Hardware Is Becoming Cool Again. IEEE is Shaping the next innovations by connecting startups and capital around tangible technologies and physical AI.
For decades, IEEE has been synonymous with Hard Tech. Its global network of over 500,000 engineers, along with its technical publications and standards, has shaped communications, semiconductors, and systems engineering worldwide. Leveraging this credibility, IEEE Entrepreneurship—the global entrepreneurship program of IEEE—and the IEEE Systems Council—which brings together 23 of IEEE’s largest scientific societies—created the Hard Tech Venture Summit series.
Today is a pivotal moment for Hard Tech. The exponential rise of AI is driving renewed demand for tangible technologies, making hardware cool again. Energy production, autonomous transportation, and fast photonics chips are just a few of the areas experiencing rapid innovation. Through the Summit, IEEE taps into this wave, providing a curated environment where technical excellence meets venture capital, giving Hard Tech founders and investors the tools and connections to accelerate development and scale. The Summit series, with events across the U.S. and Canada, kicks off April 16–17, 2026, at SRI International in Menlo Park, the historic birthplace of the computer mouse, Arpanet, the ERMA automated banking system, and the Siri spin-off.
Participation is selective and curated. Every participant—startup, investor, or mentor—is vetted by the Hard Tech Investors committee. Startups are evaluated for technical feasibility, market potential, and funding readiness, while investors and mentors are selected for their experience supporting complex hardware ventures. This creates a high-quality ecosystem where all participants share a baseline understanding of the demands of capital-intensive, long-cycle hardware development.
The Summit’s relationship-driven structure further sets it apart. Startups are assigned to structured roundtable discussions rather than relying on open networking, enabling deep, actionable conversations. A demo area and selected pitch sessions complement these discussions, allowing founders and investors to explore opportunities, exchange insights, and identify collaborations efficiently.
Adding to its practical value, the Summit offers specialized resources for scaling hardware ventures. Manufacturing workshops, led by experienced engineers, help startups evaluate and improve their Manufacturing Readiness Level (MRL)—a critical factor for moving from prototype to production-ready technology. This combination of technical guidance, curated connections, and relationship-focused engagement is rare in Silicon Valley’s crowded hardware ecosystem.
For entrepreneurs, the Summit provides a direct path to U.S. Hard Tech capital, mentorship, and ecosystem support. Founders can validate prototypes, gain strategic guidance, and forge partnerships that accelerate commercialization.
For investors, the Summit offers access to curated startups, networking with fellow hard tech investors, and opportunities to advise or co-invest in ventures poised for scale.
Dates: April 16–17, 2026
Location: SRI, 333 Ravenswood Ave, Menlo Park, CA
Early-bird registration deadline: March 13, 2026
More info & registration: click here
Ph.credit: unspashed
For decades, IEEE has been synonymous with Hard Tech. Its global network of over 500,000 engineers, along with its technical publications and standards, has shaped communications, semiconductors, and systems engineering worldwide. Leveraging this credibility, IEEE Entrepreneurship—the global entrepreneurship program of IEEE—and the IEEE Systems Council—which brings together 23 of IEEE’s largest scientific societies—created the Hard Tech Venture Summit series.
Today is a pivotal moment for Hard Tech. The exponential rise of AI is driving renewed demand for tangible technologies, making hardware cool again. Energy production, autonomous transportation, and fast photonics chips are just a few of the areas experiencing rapid innovation. Through the Summit, IEEE taps into this wave, providing a curated environment where technical excellence meets venture capital, giving Hard Tech founders and investors the tools and connections to accelerate development and scale. The Summit series, with events across the U.S. and Canada, kicks off April 16–17, 2026, at SRI International in Menlo Park, the historic birthplace of the computer mouse, Arpanet, the ERMA automated banking system, and the Siri spin-off.
Why the Summit Is Unique
The IEEE Hard Tech Venture Summit is not a traditional conference or pitch-only event. Unlike general tech gatherings that mix software and consumer apps with hardware, the Summit is exclusively focused on startups building physical technologies—from robotics and IoT to semiconductors, climate tech, space tech, and defense. This ensures that every conversation, connection, and session is directly relevant to the challenges of hard tech.Participation is selective and curated. Every participant—startup, investor, or mentor—is vetted by the Hard Tech Investors committee. Startups are evaluated for technical feasibility, market potential, and funding readiness, while investors and mentors are selected for their experience supporting complex hardware ventures. This creates a high-quality ecosystem where all participants share a baseline understanding of the demands of capital-intensive, long-cycle hardware development.
The Summit’s relationship-driven structure further sets it apart. Startups are assigned to structured roundtable discussions rather than relying on open networking, enabling deep, actionable conversations. A demo area and selected pitch sessions complement these discussions, allowing founders and investors to explore opportunities, exchange insights, and identify collaborations efficiently.
Adding to its practical value, the Summit offers specialized resources for scaling hardware ventures. Manufacturing workshops, led by experienced engineers, help startups evaluate and improve their Manufacturing Readiness Level (MRL)—a critical factor for moving from prototype to production-ready technology. This combination of technical guidance, curated connections, and relationship-focused engagement is rare in Silicon Valley’s crowded hardware ecosystem.
Opportunities for the TVLP Community
The Summit is a natural home for the TVLP community.For entrepreneurs, the Summit provides a direct path to U.S. Hard Tech capital, mentorship, and ecosystem support. Founders can validate prototypes, gain strategic guidance, and forge partnerships that accelerate commercialization.
For investors, the Summit offers access to curated startups, networking with fellow hard tech investors, and opportunities to advise or co-invest in ventures poised for scale.
Event Details
The two-day program includes pitch sessions, investor roundtables, and hands-on workshops.Dates: April 16–17, 2026
Location: SRI, 333 Ravenswood Ave, Menlo Park, CA
Early-bird registration deadline: March 13, 2026
More info & registration: click here
Ph.credit: unspashed
